APPROVAL SHEET. Cover page. Product Specification SPECIFICATION FOR APPROVAL LH500WF1-SD02(GV-JP PJT) Title SIGNATURE DATE APPROVED BY DATE - PDF Free Download (2023)

1 Cover page LH500WF1-SD02 APPROVAL SHEET Title SPECIFICATION FOR APPROVAL LH500WF1-SD02(GV-JP PJT) CUSTOMER LG Electronics SUPPLIER LG Display MODEL GV-JP MODEL LH500WF1 SIGNATURE DATE APPROVED BY DATE 정상덕 구태훈 이윤길 Preliminary Specification Final Specification Ver 1.4 February / 69

2 Contents 1. Record of revisions Page 2. General Description. 2.1 General Feature Module part list Panel part list 2.4 BLU & Bezel Part list. 2.5 FPCB Part list & Structure Optical Characteristics Optical Specifications. 4 Page 5 Page. 6 Page 7 Page 8 Page 9 Page 10 Page 3. Electrical Characteristic 3.1 Maximum Ratings Page 3.2 Electrical Characteristic... 16Page 3.3 FPC Pad Pin Assignment (Panel) Page 3.4 Pin Description (FPCB Connector)... 19Page 3.5 Block Diagram Page 3.6 Back light Unit Page 3.7 LED Specifications Page 3.8 Timing Characteristics Page 3.9 Operation Flow Chart Page 4. Mechanical Drawing 4.1 Module layout Page 4.2 Panel layout Page 4.3 FPCB Layout.. 42 Page 4.4 LED FPCB Layout Page 4.5 BLU Layout Page 4.6 FPCB Schematic Page 4.7 Gerber Data Page Ver 1.4 February / 69

3 5. Incoming Inspection Specification 5.1 Inspection Condition & AQL Level.. 50 Page 5.1 Display quality specification Page 5.2 Scratches, Dent and Extraneous Substances.. 52 Page 5.3 Glass chipping and broken Page 6. Reliability 6.1 Environmental Reliability Tests Fault Judgment Page. 54 Page. 6.3 Mechanical Reliability Tests Page. 7. Precautions for use. 7.1 Safety Page 7.2 Installation in Assembly Page 7.3 Transportation and Storage Page 8. Package 8.1 Packing Description Page 8.2 Description of Carton Material Composed Page 8.3 Description of Packing Procedure Page 8.4 Packing Box Dimension Packing Label Design 8.6 QC Flow Chart. 8.7 Designation of Lot Mark.. 65 Page 66 Page 67 Page 69 Page Ver 1.4 February / 69

4 1. RECORD Of REVISION Revision Date Contents of Revision Change Remark Final Specification Release All page Weight change (17.54g 18.5g) 4page Comment change ( LG Display) 56page Source Timing Setting (C4 Register Changed) 32page Added the Inspection Condition & AQL Level 50page Added the FOG ACF (CP5731AL) 6page Ver 1.4 February / 69

5 2. GENERAL DESCRIPTION 2.1. General Feature No ITEM Specification Remark 1 Display method Active matrix TFT 2 Display mode Transmissive Type 3 Display Resolution 1080(H) X 1920(V) 4 Active area (mm) 62.37mm(W) X mm(H) 5 Screen Size (inch) Pixel pitch (mm) mm X mm 440ppi 7 Display Color 16.7M color 8 Surface Treatment Clear 9 Outside Dimension (mm) 65.27mm(W) x mm(H) x 1.45mm(D) 10 Viewing Angle Wide view(80 /80 /80 /80 ) 11 Weight (g) 18.5± 10% 12 Driver IC R (H) x 0.85(V) x 0.17(D) 13 Method of inversion Column inversion 14 Interface MIPI 4Lane 1GHz Ver 1.4 February / 69

6 2.2. Module Part List Gap Filling Tape COG ass y FPC ass y BLU ass y Insulation Tape Remove Tape No. Name Part name Maker Amount 1 COG ass y 6061L-2407 LG Display 1) 1 2 FPC ass y 6841L-0337A Newflex 1 3 BLU ass y 6091L-2175A KJP 1 4 Insulation Tape 7250L-2544A SERVEONE 1 5 Insulation Tape 7250L-2545A SERVEONE 1 6 Remove Tape 7250L-2188A SERVEONE 1 7 Gap Filling Tape 7250L-3005A SERVEONE 1 8 Gap Filling Tape 7250L-3013A SERVEONE 1 Note. 1) COG ass y 의 Panel 은 LG Display 패널을사용함. Ver 1.4 February / 69

7 2.3. Panel Part List No. Name Spec. Maker 1 TFT Glass 0.18t Asahi 2 Color Filter Glass 0.18t Asahi 3 Upper Polarizer HC+QWP Nitto 4 Lower Polarizer APCF + HAZE 50% Nitto 5 Liquid Crystal ML1102 Merck 6 Driver IC R (H) x 0.85(V) x 0.17(D) RSP 7 ACF(COG) CP YA, 1.5mm Sony 8 ACF(FOG) AC-7823YM-18, 1.0mm CP5731AL, 1.0mm Hitachi Sony Ver 1.4 February / 69

8 2.4. BLU & Bezel Part List 1. Mold Frame 2. Tape 4. Prism (U) 5. Prism (D) 3. Diffuser 7. LGP 6. Reflector 8. LED 9. LED FPCB No. Part name Material Maker P/N Q TY Specification Maker 1 Mold Frame 4980L-0975A 1 PC (LB1010W) KJP 2 Tape (Light Shielding, Double Adhesive, etc.) 7250L-3008A E NITTO 3 Diffuser 3022L-2316A 1 38K2S KIMOTO 4 Prism (U) 3032L-1736A 1 BEF4-GMv2 3M 5 Prism (D) 3032L-1735A 1 TBEF2-GT 3M 6 Reflector 3034L-1444A 1 ESR 3M 7 LGP 5150L-0985A 1 HL8002 KJP 8 LED 6915L-0497A 12 SMFD07 SSC 9 LED FPCB 6850L-1072A 1 1 Layer - Ver 1.4 February / 69

9 2.5. FPCB Part list & Structure Top Layer Bottom Layer No. Part Name Specification Maker EA Note 1 FPC * 40.32mm, 2L, Max T Newflex 1-2 Capacitor 1uF,25V,1005, 0.55T(Max) Note 1) 6 C1~C4,C15,C16 3 Capacitor 4.7uF,10V,1005, 0.70T(Max) Note 1) 2 C5,C7 4 Capacitor 2.2uF,10V,1005, 0.55T(Max) Note 1) 2 C6,C8 5 Capacitor 1uF,6.3V,1005, 0.55T(Max) Note 1) 2 C9,C14 6 Capacitor 2.2uF,6.3V,1005, 0.55T(Max) Note 1) 4 C10~C13 7 Diode SDM10U45, SOD-523, 0.70T(Max) ROHM 1 D1 8 Connector Board to Board GB042-30P-H10, LS Mtron, 30, 0.4, HEADER, 1.0 R/TP, AU LS MTRON 1 CNT1 Note 1) Capacitor/Resistor Maker : MURATA, TAYO YUDEN, TDK, AVX-KYOCERA, Samsung Electro-Mechanics, Walsin Ver 1.4 February / 69

10 2.6. Optical Characteristic Item Symbol Condition Unit Min. Typ. Max Notes Response Time Rise Tr 25 C ms Fall Tf 25 C ms Luminance Bp Θ = 0 cd/ m Luminance uniformity ΔL Θ = 0 % Contrast Ratio C/R Θ = Top Viewing Angle Bottom CR>10 Degree Right Left Rx ) Ry ) Gx ) Color Coordination Gy NTSC 1) Θ = 0 Bx (x.y) ) By ) Wx ) Wy ) Color Gamut (CIE 1931) Θ = 0 % CCT Θ = 0 K 5,000-9,000 Cross Talk C/T Θ = 0 % Flicker F/K Θ = 0 % Ver 1.4 February / 69

11 2.7. Optical Specification (Note) [Note 1] Optical Test Equipment Setup Optical characteristics are determined after the unit has been ON and stable for approximately 5 minutes in a dark environment at 25 o C. The values specified are at an approximate distance 50cm from the LCD surface. And backlight LED current is 20mA. Optical Stage(x,y) TFT-LCD Pritchard 680 or equivalent 1 50cm Fig Optical Characteristic Measurement Equipment and Method Measuring Condition: Measuring surroundings : Dark Room Measuring temperature : T a =25 o C Adjust operating voltage to get optimum contrast at the center of the display. Measured value at the center point of LCD panel after more than 5 minutes while backlight turning on. [Note 2] Color Coordination Measured value in ±0.03~0.035, LCD Modules require the separate discuss. Ver 1.4 February / 69

12 [Note 3] Viewing Angle Viewing angle range is defined as follows; UP (12 o clock) Φ=90 o θ=0 o z A yu θ LEFT (9 o clock) Φ=180 o xl TFT-LCD Φ xr RIGHT (3 o clock) Φ=0 o yd DOWN (6 o clock) Φ=270 o Fig Viewing angle [Note 4] Contrast Ratio Contrast ratio is defined as follows; ContrastRatio( CR) = Photo detector output with LCDbeing" WHITE" Photo detector output with LCDbeing"BLACK" Ver 1.4 February / 69

13 5mm 5mm V/2 V LH500WF1-SD02 [Note 5] Luminance The luminance measurement is taken at point P5. H 5mm H/2 5mm P1 P2 P3 P4 P5 P6 P7 P8 P9 Fig Luminance measurement points [Note 6] Luminance Uniformity Luminance Uniformity = Minimum Luminance for P1 ~ P9 with all white pixels Maximum Luminance for P1 ~ P9 with all white pixels Ver 1.4 February / 69

14 Photo detector Output LH500WF1-SD02 [Note 7] Response Time Response time is obtained by measuring the transition time of photo detector output, when input signals are applied so as to make the area black to and from white. 100% 90% White White 10% 0% τ f Black τ r Fig Response Time Time [Note 8] Flicker The flicker level should be measured with horizontal gray/black stripes. The flicker is essentially a ratio of the powers in the frequency spectrum at 30 Hz (P X ) and 0 Hz (P 0- DC level). G1 G2 F = 20 Log (P X / P 0 ) G1920 Ver 1.4 February / 69

15 V/8 V/2 V V/8 LH500WF1-SD02 [Note 9] Crosstalk H H/8 H/2 H/8 P1 P2 P5 P3 P4 Fig Crosstalk measurement points A: Luminance for P1 ~ P4 with all 127gray pixels B: Luminance for P1 ~ P4 with 127gray pixels when the black box is applied A - B Crosstalk [%] = Maximum [ Absolute ( A )] Ver 1.4 February / 69

16 3. Electrical Characteristic 3.1. Absolute Maximum Rating Item Symbol Min. Typ. Max. Unit Remark Power for Analog Circuit VSP V Power for Logic Circuit VSN V Power for Interface Circuit IOVCC V Storage Humidity Hstg %RH Note 1), 2) Storage Temperature T STG C Note 1), 2) Operating Ambient Humidity H OP %RH Note 1), 2) Operating Ambient Temperature T OP C Note 1), 2) Note 1) Temp. 60, 90% RH MAX. Temp. >60, Absolute humidity shall be less than 90% RH at 60. Note 2) The diagram below indicates the peripheral environment of the module. The wet bulb temperature should be kept under 39 C and there should be no compensation. If the LSI is used above these absolute maximum ratings, it may become permanently damaged. 95% 80% Wet Bulb Temperature [ ] % Humidity [(%)RH] 40 40% Storage % 10% Operation Dry Bulb Temperature [ ] Ver 1.4 February / 69

17 3.2. Electrical Characteristic Ta + 25 C Item Symbol Min. Typ. Max. Unit Note Power for Interface Circuit IOVCC V Power for Positive Source VSP V Power for Negative Source VSN V Power for BLU Driving IBAT ma 12LEDs serial Logic Input High Voltage VIH 0.7 IOVCC - IOVCC V Logic Input Low Voltage VIL IOVCC V Frame Frequency Ff 60 Hz Iiovcc ma Current Consumption Normal Display Sleep Mode Ivsp ma Ivsn ma I iovcc-stb ma I iovcc-dsb ma BLU Driving Ibat ma 20mA/LED Iiovcc mw Power Consumption Normal Display Sleep Mode Ivsp mw Ivsn mw I iovcc-stb mw I iovcc-dsb mw BLU Driving Ibat mw 20mA/LED * All kinds of specifications and functions are optimized with the below Test condition - IOVCC : 1.8V, VSP : 5.0V, VSN : -5.0V, Column inversion, Ta 25 ** The Typ. current/power consumption is measured at the below color bar test pattern White 2. Yellow 3. Light blue 4. Green 5. Purple 6. Red 7. Blue 8. Black Ver 1.4 February / 69

18 3.3. FPC PAD Pin Assignment (Panel) No. Symbol Description No. Symbol Description 1 Dummy NC 50 VCOMDC - 2 GND GND 51~52 AGND GND 3 Dummy NC 53~54 VDD - 4 AG_Paste - 55 IOVCCRF 5~6 VCOM - 56~58 IOVCC 7 AGND GND 59 GNDRF 8 GVSS - 60~61 GND IOVCC GND 9 GND GND 62 LEDPWM LEDPWM 10 PBCTLA1 63 EXCK 11 PBCTLA2 64 DBIST NC 12 PBCTLB1 65 LNSW1 GND 13 PBCTLB2 66 LNSW0 14~15 GVDD - 67 PNSW IOVCC 16~17 VGH - 68 IM2 18~20 C21P Capacitor connection Pins 69 IM1 21~23 C21M for step-up 2 70 IM0 GND 24~26 SVDD - 71 VSOUT VSYNC 27~29 VSP 72 HSOUT VSP 30 EXPWRP 73 TE2 NC 31 VSWP NC 74 TE 32~33 SVSS - 75 CSX 34~35 VSN VSN 76 DCX IOVCC 36~37 AGND GND 77 WRX/SCL 38~39 C41M 78 DOUT NC NC 40~41 C41P 79 DIN IOVCC 42~43 VCL - 80 RESX RESET 44~46 VCI VCI 81~82 IOVCC IOVCC 47 Dummy NC 83~86 GND 48~49 VCOM - 87~90 AGND GND Ver 1.4 February / 69

19 3.3. FPC PAD Pin Assignment (Panel) continued No. Symbol Description No. Symbol Description 91~94 VCI - 151~153 IOVCC IOVCC 95~99 SVDD - 154~155 VDDLP - 100~101 VGS GND 156~158 GND 102~106 SVSS - 159~161 AGND GND 107~110 VCL Dummy1 NC 111~114 AGND 163 Dummy2 GND 115~118 GND 164~165 VCL - 119~120 VDD - 166~168 VCI IOVCC IOVCC 169~170 SVDD - 122~123 GND 171~172 VSP GND 124~126 DPHYGND 173 EXPWRN VSP 127~128 DATA2P MIPI Data2+ 174~176 VSN VSN 129~130 DATA2N MIPI Data2-177~179 SVSS DPHYGNDDUM1 GND 180 VSWN NC 132~133 DATA1P MIPI Data1+ 181~183 C31P 134~135 DATA1N MIPI Data1-184~186 C31M Capacitor connection Pins for step-up DPHYGNDDUM2 GND 187~188 VGL - 137~138 CLKP MIPI CLK + 189~190 GVSS - 139~140 CLKN MIPI CLK - 191~192 GND GND 141 DPHYGNDDUM3 GND 193 GVDD - 142~143 DATA0P MIPI Data0+ 194~195 AGND GND 144~145 DATA0N MIPI Data0-196~197 VCOM DPHYGNDDUM4 GND 198~208 Dummy NC 147~148 DATA3P MIPI Data GND GND 149~150 DATA3N MIPI Data3-208 Dummy NC Viewing Direction 208 FPC PAD D-IC Top Glass (CF) 1 Bottom Glass (TFT) Ver 1.4 February / 69

20 3.4. Pin Description (FPCB Connector) Pin No. Symbol Description Remark 1 GND I Ground 2 LED_C1 I LED Cathode connection 3 LED_C2 I LED Cathode connection 4 GND I Ground 5 IOVCC I Power supply for internal logic circuits 6 LEDPWM O LED PWM signal 7 VSYNC O Frame synchronization signal 8 /RESET I Hardware reset signal 9 GND I Ground 10 DATA1P I/O MIPI Data1 pin 11 DATA1N I/O MIPI Data1 pin 12 GND I Ground 13 DATA0P I/O MIPI Data0 pin 14 DATA0N I/O MIPI Data0 pin 15 ID_Maker I Distinction of LCD maker (LGD: Low = GND) 16 GND I/O Ground 17 DATA3N I/O MIPI Data 3 pin 18 DATA3P I/O MIPI Data 3 pin 19 GND I Ground 20 CLKN I MIPI Clock pin 21 CLKP I MIPI Clock pin 22 GND I Ground 23 DATA2N I/O MIPI Data 3 pin 24 DATA2P I/O MIPI Data 3 pin 25 GND I Ground 26 VSN I VSP(+5.0V) 27 VSP I VSN(-5.0V) 28 GND I Ground 29 LED_A I LED Anode connection 30 GND I Ground GB042-30P-H10 Fig FPC Connector Top View Ver 1.4 February / 69

21 User Connector (24 Pin) LH500WF1-SD Block Diagram VSP, VSN, IOVCC, GND G1 /RESET, Maker ID(GND) CLK+/-, D0+/-, D1+/-, D2+/-, D3+/- RESET PWM, VSYNC Scan Direction (Forward only) 1080RGB 1920 LED_A G1920 LED_C1 LED_C2 Ver 1.4 February / 69

22 V/2 V 5mm LH500WF1-SD Backlight Unit Item Symbol Min. Typ. Max. Units Surface Luminance B 12,250 13,600 - cd/m 2 Surface Brightness Uniformity B % LED Voltage V f LED Current I f V (per LED) ma (per LED) Note 1) LED Maker : SSC LED Part name : SMFD07 IF=40mA Note 2) Uniformity measure condition H 5mm H/2 5mm P1 P2 P3 P4 P5 P6 P7 P8 P9 Ver 1.4 February / 69

23 3.7. LED Specification 1) Absolute Maximum Ratings 2) Initial Electrical/Optical Characteristics Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage V F1 I F = 20mA V Reverse Current I R V R = 5V ua Luminous Flux I V I F = 20mA lm Ver 1.4 February / 69

24 3) Rank E2S 1rank Ver 1.4 February / 69

25 3.8. Timing Characteristics MIPI DSI Characteristics HS-RX LP-RX LP-TX CD-RX Item Symbol Unit Min. Typ. Max. Note Differential input high threshold VIDTH mv Differential input low threshold VIDTL mv Single-ended input low voltage VILHS mv Single-ended input high voltage VIHHS mv Common-mode voltage HS receive mode VCMRX(DC) mv Differential input impedance ZID Ω Logic 0 input voltage not in ULP State VIL mv Logic 1 input voltage VIH mv I/O leakage current ILEAK μa Thevenin output low level VOL mv Thevenin output high level VOH V Output impedance of LP transmitter ZOLP Ω Logic 0 contention threshold VILCD mv Logic 1 contention threshold VIHCD mv Notes 1. VCMRX (DC) = (VP+VDN)/2 Notes 2. Excluding COG resistance (contact resistance and ITO wiring resistance). The values are tentative Notes 3. Minimum 110mV/-110mV HS differential swing is required for display data transfer Fig Signaling and Contention Voltage Levels Ver 1.4 February / 69

26 MIPI DSI HS-RX Clock and Data-Clock Specifications Item Symbol Unit Min. Typ. Max. Note DSICLK Frequency fdsiclk MHz DSICLK Cycle time tclkp Ns DSI Data Transfer Rate tdsir Mbps Data to Clock Setup Time tsetup UI Ns ,6 Clock to Data Hold Time thold UI ns ,6 Notes 4. When fdsiclk<125mhz, change auto load NV setting so that it is compliant with THS-PREPARE+THS-ZERO spec. Notes 5. Minimum tsetup/thold Time is 0.15UI. This value may change according to DSI transfer rate. Notes 6. tsetup/thold Time are measured without HS-TX Jitter. Fig AC Timing Waveform for HS Mode MIPI Operation Ver 1.4 February / 69

27 MIPI DSI LP-RX/TX Clock and Data-Clock Specifications Item Symbol Unit Min. Typ. Max. Note Time to drive LP-00 to prepare for HS transmission THS-PREPARE ns 40ns + 4*UI - 85ns + 6*UI THS-PREPARE + Time to drive HS-0 before the Sync sequence THS-PREPARE + THS-ZERO ns 145ms + 10*UI - - Time to drive flipped differential state after last payload data bit of a HS transmission burst THS-TRAIL ns max (n*8*ui, 60ns + n*4*ui) - - 1,2 Time to drive LP-11after HS burst THS-EXIT ns Time to drive LP-00 after Turnaround Request TTA-GO 4*TLPTX Time-out before new TX side starts driving TTA-SURE 1*TLPTX - 2*TLPTX Time to drive LP-00 by new TX TTA-GET 5*TLPTX Length of any Low-Power state period TLPX ns Ratio of TLPX(MASTER)/TLPX(SLAVE) between Master and Slave side Ratio TLPX 2/3-3/2 Time that the transmitter shall continue sending HS clock after the last associated Data Lane has transitioned to LP mode TCLK-PREPARE +time for lead HS-0 drive period before starting Clock Time that the HS clock shall be driven prior to any associated Data Lane beginning the transition from LP to HS mode TCLK-POST UI 60ns + 52UI TCLK- PREPARE + TCLK-ZERO ns TCLK-PRE UI Time to drive LP-00 to prepare for HS clock transmission TCLK- PREPARE ns Time to drive HS differential state after last payload clock bit of an HS transmission burst TCLK-TRAIL ns Time from start of THS-TRAIL period to start of LP-11 state TEOT ns + n*12*ui 2 Length of Low-Power TX period in case of using DSI clock Length of Low-Power TX period in case of using internal OSC clock TLPTX1 UI TLPTX2 ns - 1/fosc - 4 Notes 1. If a > b then max( a, b ) = a, otherwise max( a, b ) = b Notes 2. Where n = 1 for Forward-direction HS mode. Notes 3. The R63311 can work with this specification although the end part of internal process is remained when Clock Lane enter LP-11 and the R63311 can work without the remained process if tclk-post is more than 256 UI. Notes 4. The R63311 uses DSI clock from the Host processor if Clock Lane is active, and internal oscillator clock if Clock Lane is disabled. Here, fosc is the frequency of oscillator clock, typical 28 MHz. Ver 1.4 February / 69

28 Fig HS Data Transmission in Bursts Fig Switching the Clock Lane between Clock Transmission and LP Mode Ver 1.4 February / 69

29 Reset Characteristics Item Symbol Test Condition Unit Min. Typ. Max. Note Reset low-level width1 trw1 Power supply on us Reset low-level width1 trw2 Operation us Reset time (Sleep IN) trt1 - ms Reset time (Sleep OUT) trt2 - ms Noise reject width tresnr - us Fig Reset operation Ver 1.4 February / 69

30 3.9. Operation Flow Chart START Power On Set Display Initial Set LCD On Flow Display On & Sleep Out Set Normal Display Display Off & Sleep In Set Deep Standby Set LCD Off Flow Power Off Set END Ver 1.4 February / 69

31 Table Power On Set Step REGISTER FUNCTION INDEX/DATA HEX 1 /RES = LOW 2 Power (IOVCC, VSP, VSN) ON IOVCC 100ms or more VSP / VSN simultaneously ON 3 40ms or more 4 /RES = LOW 5 10ms or more 6 /RES = HIGH 7 10ms or more Fig Power on sequence & Timing Ver 1.4 February / 69

32 Step REGISTER FUNCTION INDEX/DATA HEX 1 Manufacturer Command Access Protect INDEX DATA 0xB0 0x04 2 nop Command INDEX 0x00 3 nop Command INDEX 0x00 4 Interface Setting 5 DSI Control (MIPI SPEED) Table Display Initial Set INDEX DATA INDEX DATA INDEX 0xB3 0x14 0x00 0x00 0x00 0x00 0x00 0xB6 0x3A 0xD3 0xC1 0x84 0x60 0x50 0x00 0x00 0x00 0x00 0x00 0x00 0x0C 6 Display Setting1 7 Display Setting2 DATA INDEX DATA 0x01 0x58 0x73 0xAE 0x31 0x20 0x06 0x00 0x00 0x00 0x00 0x00 0x00 0x10 0x10 0x10 0x10 0x00 0x00 0x00 0x22 0x02 0x02 0x00 0xC2 0x31 0xF7 0x80 0x0A 0x08 0x00 0x00 8 Touch Panel Sync Function (VSYNC Enable) INDEX DATA 0xC3 0x01 0x00 0x00 Ver 1.4 February / 69

33 Table continued Step REGISTER FUNCTION INDEX/DATA HEX INDEX 0xC4 0x70 0x00 0x00 0x00 0x07 Source Timing Setting DATA 0x05 0x05 0x09 0x09 0x0C 0x06 0x00 0x00 0x00 0x00 9 0x07 0x05 0x05 0x09 0x09 0x0C 0x06 INDEX 0xC6 0x00 0x69 0x00 0x69 0x00 0x69 0x00 0x00 0x00 0x00 0x00 0x69 0x00 0x69 0x00 10 LTPS Timing Setting DATA 0x69 0x10 0x19 0x07 0x00 0x01 0x00 0x69 0x00 0x69 0x00 0x69 0x00 0x00 0x00 0x00 0x00 0x69 0x00 0x69 0x00 0x69 0x10 0x19 0x07 INDEX 0xC7 0x00 0x09 0x14 0x26 0x31 11 Gamma Setting A set 12 Gamma Setting B set DATA INDEX DATA 0x48 0x3B 0x52 0x5F 0x67 0x6B 0x70 0x00 0x09 0x14 0x26 0x31 0x48 0x3B 0x52 0x5F 0x67 0x6B 0x70 0xC8 0x00 0x09 0x14 0x26 0x31 0x48 0x3B 0x52 0x5F 0x67 0x6B 0x70 0x00 0x09 0x14 0x26 0x31 0x48 0x3B 0x52 0x5F 0x67 0x6B 0x70 Ver 1.4 February / 69

34 Table continued Step REGISTER FUNCTION INDEX/DATA HEX INDEX 0xC9 13 Gamma Setting C set 14 Panel Interface Control DATA INDEX DATA INDEX 0x00 0x09 0x14 0x26 0x31 0x48 0x3B 0x52 0x5F 0x67 0x6B 0x70 0x00 0x09 0x14 0x26 0x31 0x48 0x3B 0x52 0x5F 0x67 0x6B 0x70 0xCC 0X09 0xD0 15 Power Setting (Charge Pump Setting) DATA 0x00 0x00 0x19 0x18 0x99 0x99 0x19 0x01 0x89 0x00 0x55 0x19 0x99 0x01 INDEX 0xD3 0x1B 0x33 0xBB 0xCC 0xC4 16 Power Setting for Internal Power DATA 0x33 0x33 0x33 0x00 0x01 0x00 0xA0 0xD8 0xA0 0x0D 0x37 0x33 0x44 0x22 0x70 0x02 0x37 0x03 0x3D 0xBF 0x00 INDEX 0xD5 17 Vcom Setting 18 Vcom Setting (send 2 times) DATA INDEX DATA 0x06 0x00 0x00 0x01 0x39 0x01 0x39 0xD5 0x06 0x00 0x00 0x01 0x39 0x01 0x39 19 If Customer want to set other things, add Index/Data in here. Ver 1.4 February / 69

35 Table Sleep Out & Display On Set Step REGISTER FUNCTION INDEX/DATA HEX 1 Display On INDEX 0x29 2 Sleep Out INDEX 0x11 3 MIPI Video Pixel Stream ON 4 6 Frames or more 5 Android Image Display 6 Vcom Setting 7 Vcom Setting (send 2 times) INDEX DATA INDEX DATA 0xD5 0x06 0x00 0x00 0x01 0x2C 0x01 0x2C 0xD5 0x06 0x00 0x00 0x01 0x2C 0x01 0x2C 8 1 Frames or more Ver 1.4 February / 69

36 Table Sleep Out & Display On Set Step REGISTER FUNCTION INDEX/DATA HEX INDEX 0xD5 1 Vcom Setting DATA INDEX 0x06 0x00 0x00 0x00 0x48 0x00 0x48 0xD5 2 Vcom Setting (send 2 times) DATA 0x06 0x00 0x00 0x00 0x48 0x00 0x Frames or more 4 Display Off INDEX 0x ms or more 6 Sleep In INDEX 0x ms or more Table Deep Standby Set Step REGISTER FUNCTION INDEX/DATA HEX 1 Deep Standby Mode In INDEX DATA 0xB1 0x ms or more Ver 1.4 February / 69

37 Table Power Off Set Step REGISTER FUNCTION INDEX/DATA HEX 1 MIPI Video Pixel Stream OFF 2 /RES = LOW 3 10ms or more 4 Power (VSN, VSP, IOVCC) Off VSN / VSP simultaneously Off 20ms or more IOVCC Off Fig Power off sequence & Timing Ver 1.4 February / 69

38 Table DCS Data Type List Ver 1.4 February / 69

39 Table continued Note. When each data type packet is sent, it is necessary to write all parameters of each DCS and MCS. Note 1. maximum return packet size 2 Ver 1.4 February / 69

40 Table MCS Data Type List Note. When each data type packet is sent, it is necessary to write all parameters of each DCS and MCS. Ver 1.4 February / 69

41 4. Mechanical Drawing 4.1 Module Layout Ver 1.4 February / 69

42 4.2. Panel Layout Ver 1.4 February / 69

43 4.3. FPCB Layout DETAIL DETAIL Ver 1.4 February / 69

44 4.3. FPCB Layout < 사용원자재및규격 > 기준 SILVER TAPE AD [TATSUTA] PC6000 U1, AD:19μm COVERLAY PI [HANWHA] 0.5MIL, AD : 25μm AD 자재명 : HGCS-A505L(Y) 동도금 CU-PLAT HOLE속 MIN 10μm관리 CU BASE PI [DOOSAN] 0.8MIL 0.3oz / 0.3oz ED 자재명 :DSFlex E CU 동도금 CU-PLAT HOLE속 MIN 10μm관리 COVERLAY AD 자재명 : HGCS-A505L(Y) PI [HANWHA] 0.5MIL, AD : 25μm SR INK [ 니폰폴리텍 ] NPR-5BR HF No.13, ( 두께 : 15±5μm ) SILVER TAPE [TATSUTA] PC6000 U1, AD:19μm KAPTON AD 자재명 : HGCU-B550L PI [HANWHA] 5MIL, AD : 40μm TAPE AD [TATSUTA]CBF300-W6, AD:60μm SUS TSUS(Scratch) TOTAL 압착부 : FOG PAD 2Bending 部 (Coverlay 有 ) 3Bending 部 (Coverlay 無 ) 4Body-1 : EMI Tape 無 5Body-2 : Component 部 6Body-3 : Top EMI Tape 有 7Body-4 : Bottom EMI Tape 有 8CNT 체결부 : SUS 0.15T Ver 1.4 February / 69

45 4.4. LED FPCB Layout Ver 1.4 February / 69

46 4.5. BLU Layout Ver 1.4 February / 69

47 4.6. FPCB Schematic Ver 1.4 February / 69

48 4.7. Gerber Data C2 C14 C11 C13 C9 C5 C7 C16 C1 C12 C10 VR2 :NC C8 D1 C3 C4 C6 VR1:NC C15 < Top > < Bottom > Ver 1.4 February / 69

49 4.7. Gerber Data < Top_Coverlay open > < Bottom_Coverlay open > Ver 1.4 February / 69

50 4.7. Gerber Data < Top_Slikscreen > UL Mark FPC Maker UL No. LGD Part Number (Ass y) LGD Part Number (Bare) LGD Model Name&Version FPC Design Day FPC 제작주차 ex) 12년 47주차 Halogen Free Ver 1.4 February / 69

51 5. Incoming Inspection Specification 5.1. Inspection Condition & AQL Level No Items Condition 1 Ambient Illumination Cosmetic : 500~1000lux 2 Background Color Black/White Perpendicular to DUT surface ±45 degree 3 Viewing angle Reflect Mode 4 Viewing distance 30±5cm 5 Ambient Temperature 20 ~ 25 6 AQL Level Major : 0.4 / Minor : 0.65 Ver 1.4 February / 69

52 5.2. Display Quality Specification No Defect Remark 1 No Display (Major) Not allowed 2 Missing Line (Major) Not allowed 3 Darker or Lighter Line (Major) Not allowed Bright / Dark Point (Minor) Round Type (Particle, bubble) (Minor) Line Type (Particle, Scratch) (Minor) Spec. Permissible Qty Bright Point 0 Dark Point 2 Spec. Φ 0.10mm Permissible Qty Disregard mm < Φ 0.15mm mm < Φ 0.25mm 0 Spec. W 0.03mm 0.03mm < W 0.05mm, L 3.0mm 0.05mm < W 0.1mm, L 1.0mm Permissible Qty Disregard 1 1 1: If blue sub-pixel number is 1 or 2ea, it is OK. But if 2ea in diameter 20mm, it is NG. 2. If particle bright dot size is under 0.2mm, 2ea is OK. But if 2ea in diameter 20mm, it is NG. 1: Φ=(L+W)/2, L=Length W=Width 2: Disregard if out of A/A + 0.5mm (V/A + 0.1mm) 1: L=Length, W=Width 2: Disregard if out of A/A + 0.5mm (V/A + 0.1mm) L L W W 3: Ignore Scratch on Ground area of FPCB Ver 1.4 February / 69

53 5.3. Scratches, Dent and Extraneous Substances No Defect Remark 1 Surface F/M on POL. & LCD Back side - - Ignore if F/M is removed after cleaning 2 LCD Back side S/C - - Ignore if S/C is no affect LCM Operating. 3 Visible of POL. Edge Adhesive - - 1: Missing : Ignore if it exists within 0.5mm from V/A to B/M 2: Bleed-out : Ignore Ver 1.4 February / 69

54 5.4 Chipping and Broken No Item Criterion for Defects Defect Type Remark Size [mm] 1 Glass Chipping [Pad Area] a 0.3 b 5.0 Minor c t Size [mm] 2 Glass Chipping [Rear of Pad Area] a 0.5 b 5.0 Minor c t Size [mm] 3 Glass Chipping [Except Pad Area] a 0.5 b 5.0 Minor c t Size [mm] a 0.5 b 3.0 Size [mm] a 3.0 b Glass Chipping [Corner] Minor 5 D-IC Chipping [Top/Back side] Scribe Line 침범없을것 (Red Line) X,Y( 모서리 ) 50um A,B( 중앙 ) 40um Minor Ver 1.4 February / 69

55 6. Reliability 6.1 Environmental Reliability Tests No Test Item Test Conditions Quantity Remark 고온동작 High Temperature Operation 저온동작 Low Temperature Operation 고온고습동작 High Temperature and High Humidity Operation 고온저장 High Temperature Storage 저온저장 Low Temperature Storage 고온고습저장 High Temperature and High Humidity Storage 열충격 Thermal Shock 70, 96 Hr 10-20, 96 Hr 10 60, 90% RH, 96 Hr 10 80, 96Hr 10-30, 96 Hr 10 60, 90% RH, 96 Hr (30min) ~ 80 (30min), 24 Cycle 5 8 ESD Electrostatic Withstanding Voltage Air : 0Ohm 200pF ± 200V Contact : 0Ohm 200pF ± 200V 2 9 포장진동 Package Vibration Test 10~55Hz, 1.5mm, X/Y/Z 6 시간 1 1Hr 10 포장충격 Packing shock 76 cm, 8corner, 6 face / Drop 1 Packing In a box 6.2 Fault Judgment TFT- LCD Module should be at room temperature for 24 hours when the display quality test is over. There should be no particular change which might affect the practical display function and the display quality test should be conducted under normal operating condition. Ver 1.4 February / 69

56 6.3 Mechanical Reliability Tests 1) Panel 4 Point Bending Test Condition 1. Supporting Jig : Ø 3, Loading Jig : Ø 3 2. Jig Speed : 1mm/min 3. Test Point : X axis rear, Y axis rear 4. Jig length (L): - L1 : 10mm, L2 : 20mm (SPEC) Item 4-Point Bending Test B10 (Weibull 10%) Spec No. of Panel B10 : X axis 90Mpa, Y axis 90Mpa 24ea for each condition (48ea) Ver 1.4 February / 69

57 2) Driver IC 3PB Test Test Condition Test Method : 3 Point Bending Test 1. Supporting Jig : 3mm, Loading Jig : 3mm 2. Jig Speed : 1mm/min 3. Test Point : X axis, Y axis 4. Jig length (L) : 10mm 5. Jig Material : Steel (or Al) (SPEC) Item 3-Point Bending Test B10 (Weibull 10%) Spec No. of IC B10 : Higher than 350Mpa 24ea Formula for Stress : P (L2-L1) σ = 2 b h² (σ : Flexural Stress) (Mpa) b : item width (mm) h : item thickness (mm) L : Length between supports (mm) P : Load (kgf) Ver 1.4 February / 69

58 7. Precautions for Use 7.1. Safety 1) DISASSEMBLING OR MODIFICATION Do not disassemble or modify the modules. Sensitive parts inside LCD module may be damaged, and dusts or scratches may mar the displays. LG Display does not warrant the modules, if customer disassembled or modified them. 2) BREAKAGE OF LCD PANEL Do not Ingest liquid crystal material, Do not Inhale this material, and Do not Permit this material to contact the skin, if glass of LCD panel is broken. If liquid crystal material contacts the skin, mouth or clothing, take the following actions immediately. In case contact to the eye or mouth, rinse with large amount of running water for more than 15 minutes. In case contact to the skin or clothing, wipe it off immediately and wash with soap and large amount of running water for more than 15 minutes. The skin or closing may be damaged if liquid crystal material is left adhered. In case ingestion, rinse out the mouth well with water. After spewing up by drinking large amount of water, get medical treatment. 3) GLASS OF LCD PANEL Be careful with chips of Glass that may cause injuring fingers or skin, when the glass is broken. 4) ABSOLUTE MAXIMUM RATINGS Do not exceed the absolute maximum rating values under the worst probable conditions caused by the supply voltage variation, input voltage variation, variation in parts' constants, environmental temperature, etc., otherwise LCD module may be damaged. 5) POWER PROTECTION CIRCUIT Employ protection circuit for power supply, whenever the specification specifies it. A suitable protection circuit should be applied, based on each system design. A fuse is not fitted to this module. Therefore, without a suitable power-supply protection device, dust or partial circuit failure may cause overheating and/or burning, which may lead to injury. 6) DISPOSAL Always comply with all applicable environmental regulations, when disposing of the LCD. 7) EDGES OF PARTS Be careful with edges of glass parts and metal frame, it may cause injuring. For designing the system, give special consideration that the wiring and parts do not touch those edges. Ver 1.4 February / 69

59 8) RECOMMENDED OPERATING CONDITIONS Don't exceed the recommended operation conditions in this specification. The performance and quality of the LCD module are warranted only when the LCD module is used within the recommended operation conditions. To use the LCD module over the recommended operation conditions may have bad influence on the characteristics and reliability of the LCD module and may shorten the life of the LCD module. Therefore, when designing the whole set, not to be over the recommended operation conditions, you should fully take care of supply voltage change, characteristic of connection parts, serge of inputand-output line, and surrounding temperature Installation in Assembly ESD (ELECTRO-STATIC DISCHARGE) PREVENTION The circuit used in LCD module is very sensitive to ESD. The following caution should be taken when installing LCD module to an enclosure of the system in order to prevent damage of circuit used in LCD module. 1) HUMIDITY Ambient humidity of working area is recommended to be higher than 50%(RH) in order to avoid ESD. 2) GROUNDING - Person handling LCD modules should be grounded with wrist band. - Tools like soldering iron and screw drivers and working benches should be grounded. - Grounded electro-conductive mats are recommended to be covered on the floor of working area and surface of working benches. - The grounding should be done through a resister of 0.5~1Mohms in order to prevent spark of ESD. 3) Be careful with touching metal portion of testing instruments in order to prevent unnecessary ESD. 4) Do not touch the electrode area of PCB and electrical parts like LSI, capacitor, connector pin, etc. 5) IONIZER Using ionizer (an antistatic blower) is recommended at working area in order to reduce electro-static voltage. 6) REMOVING PROTECTION FILM When removing protection film from LCD panel, peel off the tag slowly (more than one second) while blowing with ionizer toward the peeling face to minimize ESD which may damage electrical circuit. Ver 1.4 February / 69

60 DUST AND STAIN PREVENTION 1) WORKING AREA Reduce dust level in working area. Especially the level of metal particle should be decreased, otherwise electrical circuit in LCD module may be damaged due to short circuit by metal particles. 2) FINGER PRINT Use finger stalls or soft and dust-free gloves in order to keep clean appearance of LCD module when handled for incoming inspection and assembly. 3) PROTECTION FILM LCD module may be shipped with "protection film" on LCD panel in order to prevent from scratches and dust. It is recommended to remove the film at later process of assembling. 4) WIPING OFF DUST ON THE PANEL When LCD panel becomes dirty, wipe the panel surface off softly with absorbent cotton or another soft cloth. If necessary, breathe upon the panel surface and then wipe off immediately and softly again. Be careful not to spill organic solvents into the inside of LCD module. The solvents may damage driver IC and PCB area used inside module. The polarizer laminated to LCD panel and adhesives may be damaged by the solvents, so do not use any organic solvents for wiping off LCD panel. 5) ADHESIVE ON LCD PANEL Be careful not to attach adhesive, grease, etc., on LCD panel, because it is difficult to remove them without any damages on LCD panel. 6) WATER SPOTS ON THE PANEL Avoid the dewing or water condensation. Wipe off a spot or spots of water or mist on LCD panel softly with absorbent cotton or another cloth as soon as possible if happened, otherwise discoloration or stain may be caused. And, damage may occur if water penetrates the inside INSTALLING LCD MODULE TO THE ENCLOSURE 1) INSTALLING LCD MODULE TO THE ENCLOSURE Do not bend or twist LCD module even momentarily when the LCD module is installed into the system. Bending or twisting the LCD module may cause permanent damage. When the FPC is bent, the radius of FPC curvature must be more than value of recommendation to prevent bending and twisting forces from affecting the connection of FPC. Even temporary bending or twisting sometimes causes damage. 2) INTERFACE Do not fasten screws, with catching interface FPC between LCD module and the enclosure. This may cause bending of LCD module, or become the cause of a failure by damaging FPC. Ver 1.4 February / 69

61 MECHANICAL FORCES 1) CARRY Hold the side of the plastic frame when you carry an LCD module by hand. If an LCD is carried using the FPC, it is likely to be damaged and the LCD will then malfunction. If you turn on the LCD with a broken FPC, it may cause smoke or burning. Protection (eg gloves) for fingers and hands is recommended to avoid injury by broken glass. 2) STRONG MECHANICAL SHOCK Avoid strong mechanical shock, such as dropping the LCD from the work bench, or knocking it against a hard object. These may cause the glass panel to crack, or cause other mis-operation. 3) EXCESSIVE FORCE Avoid applying excessive force, like pushing the surface of LCD panel. This may cause scratches or breakage of the panel, or a failure of the module. 4) SCRATCHES ON THE PANEL Do not put heavy object such as tools, books, etc., and do not pile up LCD modules. Be careful not to touch the surface of the polarizer with any hard and sharp object. These parts are so sensitive and can easily be scratched, even if protected by a film. 5)Connector When inserting or disconnecting the connector into a connector of the LCD module, care should be taken to ensure that no strong external force is applied to the connector on the LCD module side. A strong external force applied to the connector or the FPC may damage their connections. When assembling a module into a system, pay extra attention to ensure that no part such as the FPC etc. should be caught between the case of the system and the module. Make sure that the input signal connector of a module is securely and correctly connected to the connector on the system, not skewed, or incompletely connected. Inputting a signal etc. into the module with connectors incorrectly inserted may cause a circuit component or components to malfunction. 6) FPC When inserting or disconnecting the connector of the LCD module into a connector of the system, care should be taken to ensure that no strong external force is applied to the FPC on the LCD module side. A strong external force applied to the FPC may damage their connections. When assembling a module into a system, pay extra attention to ensure that no part such as the FPC etc. should be caught between the case of the system and the module. Make sure that the input signal connector of a module is securely and correctly connected to the connector on the system, not skewed, or incompletely connected. Inputting a signal etc. into the module with connectors incorrectly inserted may cause a circuit component or components to malfunction. Be careful not to pull or damage the FPC cables, to avoid mechanical damage in FPC and connection part of FPC and cell. Ver 1.4 February / 69

62 OPERATION 1) POWER SUPPLY Power supplies should always be turned off during the assembly process. Do not connect or disconnect the power cables and connectors with power applied to LCD module. This may cause damage to the LCD module circuit. In operating module at the inspection process, and so on, the supply voltage and signals of driving device must satisfy the sequence of power supplies and signals described in this specifications. 2) GAS Do not expose the LCD module to any gas which is not normally contained in the atmosphere, it may cause mis-operation or defects. 3) USED FOR LONG TERM When a LCD module is used for a long term, the characteristics of LCD module might be changed and it may be out of the standard of 4.0 Optical Specifications due to LED discoloration. LED has the characteristics of shifting optical characteristics by the long term use Transportation and Storage 1) TEMPERATURE Do not store LCD modules in a high temperature and high humidity condition, higher than 35ºC and 70%(RH) for a long term, meaning about one month or more, otherwise this may deteriorate the quality of the display. When you unavoidably store LCD modules for a long time, store between 0 and 35ºC, with a relative humidity 70% or lower. 2) LOW TEMPERATURE Be careful not to leave it where the temperature is below specified storage temperature because the liquid crystal of the display panel may be damaged. 3) ULTRA VIOLET RAY Store LCD module without exposure to direct sunlight or fluorescent lamps in order to prevent the module from strong ultra violet ray. 4) CLEANLINESS Keep the LCD module in clean place, because any dust, hard particle may damage the polarizer, or dust invades the inside of the LCD module. Ver 1.4 February / 69

63 5) CONDENSATION OF WATER The modules should be stored under a condition where no condensation of water is allowed. It may cause mis-operation or defects. Be especially careful not to make a module work under the condition that condensation of water appears. 6) PACKAGING When you must re-package a LCD module after it has been removed from the original packaging, it is recommended to re-pack using the original package box and package material. Ver 1.4 February / 69

64 8. Package 8.1. Packing Description Packing Condition Contents Packing Type EPP packing type EPP material model EPP (10 9 ~10 12 Ω) EPP packing type See the picture 1 Number of panels per EPP 6 pieces Number of EPP per carton 11+1(empty) units Number of panels per carton 66 pieces 8.2. Description of Carton Material Composed No Description LCD Module EPP Tray Packing Carton PE Bag Carton Quantity Ver 1.4 February / 69

65 8.3. Description of Packing Procedure T.B.D Ver 1.4 February / 69

66 8.4. Packing Box Dimension T.B.D Ver 1.4 February / 69

67 8.5. Packing Label Design 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) < BOX, Pallet Label > 1) Base model name 2) Suffix1 3) LCD s Part Number at Customer 4) Product Volume : declaring the volume of product in the BOX/PALLET 5) Lot/MM-DD - Lot No : declaring the BOX/PALLET No. in the number according to Production plan in sequence. - MM-DD :declaring packing Month/day 6) REMARK - Register the Production change facts 7) Origin declaration : ( Only Module business) - LGD KUMI : MADE IN KOREA 8) Declaration RoHS and halogen free verified expression 9) Barcode Type : Code 128A Type 10) Suffix2 Ver 1.4 February / 69

68 LH500WF1-SD QC Flow Chart QC Flow Chart_Assembly(Rev.01) Flow Chart Relation No. Section Item Standard Back Light Normal Material B/L Input Mass Production Component Quality Guarantee Work B/A Module ESD ESD Board Normal Assy Assembly Module Defective Edge Damage Product Action LED FPC Normal Module Soldering Temperature Tape Gap Filling Normal Module Tape Misalign Tape Gap Filling Normal Module Tape Misalign Insulation Tape Insulation Tape Sticking Normal Misalign Module Insulation Tape Insulation Tape Sticking Normal Misalign Module Pulling Normal Module Tape Sticking Misalign Normal Module Marking Omission/Repetit ion Inspection Module Final Inspection 10 Quality Test Inspection Inspection Working Inspection Module Surface Inspection 11 Quality Test Inspection Inspection Working Module Faulty Repair 12 Repair Production Condition Action BOX Normal Module 13 BCR Input Packing Standard No. B-QA-ST Standard Detail Standard Standard Standard No. BLU&B/A Input B-MO-WI- P/N Check Working Manual MA050 Module ESD Under ±200V Not B/A Working Existence Manual LED FPC 340±20 Soldering Working Manual Insulation Tape Not Sticking Existence Working Manual Insulation Tape Not Sticking Existence Working Manual Insulation Tape Not Sticking Existence Working Manual Insulation Tape Not Sticking Existence Working Manual Not Existence Pulling Tape Sticking Working Manual Serial Number Not Print Existence Working Manual Model Inspection Standard MES System Model Inspection Standard MES System Repair Working Manual Model Outer Packing Working Manual Facility Facility Period One time Ionizer Per Quarter Soldering Iron Pincette Pincette Pincette Pincette Pincette Marking Machine Final Inspection Machine One time Per Month Measuring Machine Equipment Calibration Gage R&R Measuring One time Machine Per Year Measuring One time Machine Per Year Monitoring SMPL Data Size Occurrence Quantity Temperature Faulty Quantity Faulty Quantity Repair Quantity Frequency One time Per Month Three times Per Day All All All Control/ Capability Type Action Judgment Abnormal Occurrence Action Person in Method Standard charge Return Line Chief Module Line Abnormal Occurrence Action Module ESD Readjustment PM Discard Supervisor Module Line Abnormal Occurrence Action Repair Worker /Discard Module Line Abnormal Occurrence Action Repair Worker /Discard Module Line Abnormal Occurrence Action Repair Worker /Discard Module Line Abnormal Occurrence Action Repair Worker /Discard Module Line Abnormal Occurrence Action Repair Worker /Discard Module Line Abnormal Occurrence Action Repair Worker /Discard Module Line Abnormal Occurrence Action Repair Worker /Discard Module Line Abnormal Occurrence Action Repair Worker /Discard Module Line Abnormal Occurrence Action Repair Worker /Discard Module Line Abnormal Occurrence Action Repair Worker /Discard Module Line Abnormal Occurrence Action Return OP Standard No Ver 1.4 February / 69

69 LH500WF1-SD QC Flow Chart QC Flow Chart_TAB(Rev.01) Flow Chart No. Section Item CELL Normal Cell Stock Cell History Abrasive Cloth Input Quantity Normal Abrasive Cloth Clean Rotary Speed ESD POL Roller Gap Adjustment Normal POL ESD Sticking Inspection Sticking Level ACF ACF Normal Sticking Material (ACF) Temperature Pressure Time Temperature Pressure Time COG COG 2 nd Normal Misalign (CTQ) Bonding Conductive Ball Pressure Mark (CTQ) ACF ACF Normal Sticking Material (ACF) Temperature Pressure Time FOG Temperature Pressure Time FOG 2 nd Normal Bonding Bonding Strength Misalign Conductive Ball Pressure Mark AG Resin Material Normal AG Dotting (AG Paste) Spread Material Rear Resin Normal (UV Resin) Spread Spread Inspection 10 B/A Inspection Quality Test POL Repair 11 Repair Condition COG Repair 12 Condition Repair FOG Repair 13 Condition Repair Relation Standard Module Module PM Working Module PM Working Module ESD Working M_PM Working Module ESD Module Inspection Working M_ Material Module Module M_Inspection Working M_Inspection Working M_ Material Module Module Module M_Inspection Working M_Inspection Working M_ Material M_ Material Module Inspection Working Module Faulty Production Action Module Faulty Production Action Module Faulty Production Action Standard No Standard Detail Standard Standard Standard No. Stock Cell Stock Quantity B-MO-WI- Check MA003 Working Manual 1.5±1.0mm Clean Machine Working B-MG-WI- MC ±200 RPM Clean Machine Working B-MG-WI- MC022 Under Module ESD ±200V Working Model POL Sticking MC Working Manual B-MG-WI- MC021 Under ±200V Module ESD Model POL Sticking Level Measurement Working Manual B-MO-WI- MA022 ACF -10~5 B-MO-WI- Working Manual MA026 COG M/C Model B-MG-WI- Working Manual MC023 COG M/C Model B-MG-WI- Working Manual MC023 Over 15um COG Align Level Measurement Working Manual B-MO-WI- MA020 Over 3 Level COG Conductive Ball Pressure Mark Level Measurement Working Manual B-MO-WI- MA031 ACF -10~5 B-MO-WI- Working Manual MA026 FOG M/C Model B-MG-WI- Working Manual MC023 FOG M/C Model B-MG-WI- Working Manual MC023 FOG Bonding 500gf/Cm Strength B-MG-WI- Measurement MA032 Working Manual Over X 50% FOG Align Level B-MO-WI- Over Y 20% Measurement MA028 FOG Conductive Over 10ea Ball B-MO-WI- /Single Pad Pressure Mark MA027 Level Measurement Spread Machine Under 25 M/C Working B-MO-WI- MC024 Manual Spread Machine 10~25 M/C Working B-MO-WI- MC024 Manual Model Model Inspection Inspection Working Standard (E-memo) POL Repair Model B-MO-WI- Working Manual MA039 TAB Repair Model Working Manual B-MO-WI- MA040 FPC Repair Model Working Manual B-MO-WI- MA037 Facility Facility Period Clean Machine Clean Machine One time Ionizer Per Quarter POL Sticking One time Machine Per Month One time Ionizer Per Quarter Refrigerator ACF Sticking nd Bonding Machine 1st Bonding Machine nd Bonding Machine Refrigerator ACF Sticking nd Bonding Machine 1st Bonding Machine nd Bonding Machine B/A One time Inspection Machine Per Month POL Repair Machine COG Repair Machine POL Repair Machine Measuring Machine Equipment Calibration Gage R&R Measurement necessary necessary Machine Measurement necessary Machine Vernier Callipers necessary Thermometer Gage Gage Microscope Microscope necessary Thermometer Gage Gage Strength Measurement necessary Machine Microscope Microscope necessary Monitoring SMPL Data Frequency Size ALL When Stocked Input Quantity n=1 M/C Rotary Speed n=1 M/C Occurrence One time n=1 Quantity Per Month Unneces sary M/C Occurrence One time n=1 Quantity Per Month Sticking One time n=2 ea Level Per 2 Hours Unneces sary n=1 M/C Condition n=1 M/C Condition M/C M/A n=2 One time Quantity (unit) Per 2 Hours M/C Pressure Mark n=2 One time Quantity (unit) Per 2 Hours Unneces sary n=1 M/C Condition n=1 M/C Condition Bonding n=2 M/C Strength (unit) One time /Shift M/C M/A n=2 One time Quantity (unit) Per 2 Hours M/C Pressure Mark n=2 One time Quantity (unit) Per 2 Hours Unneces sary Unneces sary Faulty Quantity ALL ALL Repair Quantity ALL ALL Repair Quantity ALL ALL Repair Quantity ALL ALL Control/ Capability Type Action Judgment UCL,LCL X-bar/R Ideal value LSL X-bar/R Ideal value LSL X-bar/R Ideal value LSL LSL LSL Abnormal Occurrence Action Method Person in Standard charge Standard No. Notice Worker Module Line Abnormal Occurrence Action Readjustment Tech Module PM Working Readjustment Tech Module PM Working Readjustment Tech Module ESD Working Readjustment Tech Module PM Working 00022)-R7 Readjustment Worker Module ESD Module Faulty Readjustment Tech Production Action Discard Material M_ Faulty Component /Return Worker Action Module PM Readjustment Tech Working 00022)-R7 Module PM Readjustment Tech Working 00022)-R7 Module PM Readjustment Tech Working 00022)-R7 Module PM Readjustment Tech Working 00022)-R7 Discard Material M_ Faulty Component /Return Worker Action Module PM Readjustment Tech Working 00022)-R7 Module PM Readjustment Tech Working 00022)-R7 Module PM Readjustment Tech Working 00022)-R7 Module PM Readjustment Tech Working 00022)-R7 Module PM Readjustment Tech Working 00022)-R7 Discard Material M_ Faulty Component /Return Worker Action Discard Material M_ Faulty Component /Return Worker Action Repair Module Line /Discard Worker Abnormal Occurrence Action Repair /Discard Worker Module Line Abnormal Occurrence Action Repair /Discard Worker Module Line Abnormal Occurrence Action Repair /Discard Worker Module Line Abnormal Occurrence Action Ver 1.4 February / 69

70 8.7. Designation of Lot Mark Byte Factory Code 2. Lot Type Byte 1 2 Byte 3 Mark Description Mark Description M 4 Gumi X P Dasol X C KRems X T H&H X U Tovis (Dalian) J 1 LGD (Yantai) Mark B R G Desc. Normal Rework GIB X L Raygen (Yantai) X K Dasol (Yantai) P Packing 3. Year/Month/Data of Production Byte 4 Year : 0~9 Byte Byte 5 6 Month : 1~9, A~C (Except I/O) Date : 1~9, A~Z (Except I/O) 4. Serial Number : 0001 ~ Z999 (Except I/O) Byte 7 0~Z (Except I/O) Byte 8 0~9 Byte 9 0~9 Byte 10 0~9 Lot Mark Ver 1.4 February / 69

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